INTERNEPCON JAPAN

ASIAS LARGEST Exhibition featuring all kinds of Equipment, Materials and Technologies for Electronics Manufacturing and SMT

ELECTROTEST JAPAN

Exhibition featuring all kinds of Test, Inspection and Measurement Systems for SMT, IC Packaging and Board Manufacturing

IC PACKAGING TECHNOLOGY EXPO

Specialised in Packaging Technologies for Semiconductors, LED, MEMS, Sensors

ELE EXPO-ELECTRONIC COMPONENTS EXPO

Japans Most Powerful Exhibition for all kinds of Electronic Components and Devices

PWB EXPO Printed - Wiring Boards Expo

Exhibition featuring PCBs/PWBs, PCB Materials, Design & Development Services, Design Tools

MATERIAL JAPAN - Advanced Electronic Materials Expo

Exhibition featuring Electronic Materials and Technologies

MicroTech JAPAN - Micro Fabrication / Fine Process Technology Expo

Exhibition specialised in all kinds of Processing Technologies for Electronics Manufacturing

동경 전자제조 및 SMT 박람회 (INTERNEPCON JAPAN )

Mounters. Cream Solder Printers. Dispensers. Carrier Tapes. Parts Feeders. Marking System / Ink. ERP / SCM. Punching / Pressing Machines. Sealing Machines. Washing Machines. Electromechanical Parts. Various Tools. Various Software. Rework / Repairing Machines. Masks. Taping Machines. Carrier Tape Forming Equipment. Laser Processors. Precision Welders. Production / Factory Control, Regulating Systems. PCB Separators. Cable Ties. Inspection / Testing / Measuring Equipment. Electronic Materials. Other Related Products.

동경 전자계측 및 테스트 박람회 (ELECTROTEST JAPAN)

Board Vision Inspection Equipment ./Solder Vision Inspection Equipment. /Infrared Test Equipment ./X-ray Inspection Equipment /Ball Machine Vision Inspection Equipment /TAB Vision Inspection Equipment / Bump Vision Inspection Equipment / IC / PCB / Components Vision Inspection Equipment / Lead Frame Vision Inspection Equipment /BGA / CSP Rework System / Equipment / Boundary-scan Testers / In-Circuit Testers / Functional Solder Testers /Testing Sockets for BGA, CSP/IC / LSI Testers. / Bare Board Testers. /Inspection jig / Test Fixtures / Probes / Testing tages .

Burn-in Equipment /2-D / 3-D Inspection Equipment. /Film Thickness Measurement Equipment. /Environmental Test Equipment. /Reliability / Evaluation Inspection Equipment . /Analysis Equipment / Software. /Various Measurement / Inspection / Analysis Devices./ Other Various Testers, Inspection, Measurement Equipment and Devices./Contract Analysis Services ./CCD Cameras / Other Cameras for Testing. /Lenses

동경 반도체 패키징 기술전 (IC PACKAGING TECHNOLOGY EXPO)

Assembly Equipment

Wire Bonders .Die Bonders. FC Bonders. Other Various Bonders. Molding Machines . Resin Coating Machines.Dicing Machines . Lead Processing Machines .Laser Processors. Other Equipment for IC Packaging

Packaging Materials/Components

Sealant (Mold Materials)/Under-fill Materials .ACF/NCF, ACP/NCP .Die Adhesives .Lead Frames. Bonding Wires .Tape Materials . Soldering Balls/Materials. Bump Materials .Packaging Substrates(PCBs, Tape Substrates, Ceramic Substrates, etc.) .Other Materials/Components

Analysis/Simulation Software for IC Packaging

Analysis Services/Software .Simulation Software . Various Software, etc.

Various Packages

CSP .BGA . Wafer Level CSP .MCM, etc.

Semiconductor Device Inspection & Testing Zone

Memory Testers. SoC Testers. IC Test Sockets .IC Test Clips. Inspection Connectors .Burn-in Inspection Equipment .(Reliability Test, Thermal Resistance Test). IC Vision Inspection System . Bump Vision Inspection System . X-ray Inspection Equipment. Circuit Modification System/Software. efect Analysis System/Software . Measurement Equipment .Test Services .Analysis Services .Handlers .Probe Cards.Probes 　etc.

SATS/Contract Design Services Zone

Semiconductor .LED Packaging Solutions. Sensor Module Assembly. Mounting, Packaging Solutions. MEMS Device Packaging Solutions. Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.

Plating/Etching Zone

Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.Plating Materials/Chemicals/Equipment. Plating Process .Etching Chemicals/Equipment. Etching Process .Inspection Equipment. Surface Processing Technology/Related Products, etc.

MEMS Packging Zone

MEMS Device Manufacturing Equipment / Molding Machines/Evaluation/Measurement/Testing Equipment/MEMS Packaging Materials/MEMS Foundry Services /Design Tools, Analysis and Simulation Software/Other Various MEMS Packaging Technologies

동경 전자부품 박람회 (ELE TRADE EXPO)

Condenser/Capacitor. Resistor. Filter. Relay. Motor. Connector & Cable. Inductor/Coil. Transformer. Crystal Devices. Fuse. IC. Thermal Design/Noise Reduction Components. Other Component & Device etc.

General Electronic Components

Condensers/Capacitors. Transformers/Inductors/Coils. Resistors. ICs. Filters. Resonators/Oscillators. Crystal Related Products. LEDs. Switches. Relays. Magnetic Contactors/Circuit Breakers. Memory Cards. Various Acoustic Components. Various Fuses. Various Motors. Various Modules. Various Sensors. Switching Power Sources. Various Batteries

동경 인쇄회로 박람회 (PWB-PRINTED WIRING BOARDS EXPO)

PWBs/PCBs

Rigid PCBs .Multi-layered PCBs. Flexible PCBs. Multi-layered Flexible PCBs .Flexible Rigid PCBs. Built-up PCBs. Semiconductor Packaging PCBs. TOB/COF PCBs .Optical PCBs .EPD (Embedded Passive Devices) .Other PCBs

PCB Materials

Rigid Copper-clad laminate .Flexible Copper-clad laminate .Shield Board . Multi PCB Prepreg .Copper Foil .Insulating Material

Design/Development Tools Zone

Gathering Design/Development Tools from Functional Design Tools to Simulation Tools and CAD/CAM. Functional Design/Logic Design Tool .Pattern/Layout Design Tool .CAD/CAM/CIM .Transmission Line Simulator . SI/PI/EMC Analysis .Heat Analysis .Design Data Control Tool

ODM/Design Services Zone

Gathering Various ODM, Design Services and Contract Development Services .Contract Design Services .Contract Development Services . Prototype Development Services .Consulting Services

동경 소재 박람회 (MATERIAL JAPAN)

Materials for Mounted Circuit

Polyimide Film .Conductive Polymer .Adhesive Tape .Solder. LCD Polymer Film .Copper Foil .Circuit Conductive Ink/Paste .Dye Bonding Agent. PET Film .Alminium Foil .Antistatic Material .Resist etc. PPS Film. Conductive Adhesive. Sealant. Chemical Agent .PEN Film. Light Curing Adhesive .Heat Shrinkable Tube. Copper Clad Laminate .Engineering Plastic Film .Adhesive Compound .Heat Radiation Sheet .

Materials for Record Medium

Base Film .Sensitive Material .Resin .Coating Agent . Magnetic Agent .Colored Dye .Plating .Glass Substrate etc.
Materials for Semiconductor

Sealant. Chemical Agent .Underfill Material. CMP Pad. Particular Gas . Polycrystal Silicon. Coating Insulating Resin. CMP Slurry .Photoresist .Silicon Carbide etc.

Materials for Display

Alignment .Resist, Liquid Developer, Detachment .Sealing Material .Dry Material .Electrode Material .Optical Film . LCD Material .Functional Film. Encapsulation Resin .Characteristic Increment Film. OLED/Luminescence Material .Coating Film etc.

Materials for Battery

Positive/Negative Electrode Material .Insulation Tube. Current Collector .Hydrogen Storing Alloy. Safety Valve . Separator .Electrolyte .Activated Charcoal .Electrode Foil .Ionic Liquid etc.

Other Materials

Nano Technology Materials. Photocatalyst Materials. Ceramic Materials . Biodegradability Materials .Hybrid Materials. Intelligent Materials etc.

동경 전기 및 하이브리드 박람회 (EV & HEV JAPAN)

Drive System

HEV/EV Drive System. In-wheel Motor System

Rechargeable Batteries, Next-generation Batteries

Lithium Ion Batteries .Lithium Polymer Batteries.Thin Film Lithium Ion Batteries.Nickel Metal Hydride (NiMH) Batteries .Nicad Batteries.Components & Materials for Batteries　　etc. Lead Acid Batteries .NaS Batteries .Secondary Air Batteries .Capacitors, Condensers. Battery Manufacturing Technologies　

Motor Technologies

Automotive Motors. Parts and Materials. Controllers. Measurement and Simulation. Production Facilities.

Inverters, Peripherals

Inverters, Converters. Power Devices. Passive Elements. Heat-Resistant Products. Inverter Evaluation and Testing System. Chargers. Connectors, Harnesses

동경 LED/OLED 조명기술 박람회

Inspection. Measurement. Test. Evaluation Equipment

Appearance Inspection System . LED Measuring System . Illuminance Measuring Instrument . Thermal Resistance Measuring Instrument. Evaluation/Analysis Service, etc. Surface Inspection System. Luminance Measuring Instrument .Life Testing Machine. Color Measuring Instrument

Lighting Devices

LED. Other Lighting Devices

Lighting Control Technologies

Driver. Driver IC . Other Lighting Control Devices, etc. Driver Component. Sensor Module

Other Lighting Devices

Design Tool/Design Software. Product/Technology/Service for Lighting System. Equipment/Component for Lighting Module/Lighting Unit. Various Contract Services, etc

Lighting Control System Zone

Lighting Control Solution. Cloud Server. Switch. Lighting Control Console. Display Panel. Wireless Communication System. Motion Sensor. Controller. BEMS(Building and Energy Management System). Monitoring Device. Management Server. Dimmer. Annunciator. Cable. Illuminance Sensor. IP Camera. Relay. Remote Control.

Fixing Zone

LED Light Fixing. Maintenance and Inspection Service. Installation Environment Research Service. Wiring Device/Cable Reel. Fixing Tool. Safety Rope. Electrical Shock Prevention. Wiring Work. Monitor Service. Insurance Service. Repairing Material. Work Uniform. Lightning/Snow/Wind Damage Control. Antitheft Device